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Inkjet printing of conductive materials: a review

AbstractPurpose– The purpose of this paper is to present an exhaustive review of research studies and activities in the inkjet printing of conductive materials. Design/methodology/approach– This paper...

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Integrated MEMS in package

AbstractPurpose– The purpose of this paper is to present the utilities of packaging and PCB fabrication processes for manufacturing micro electromechanical systems (MEMS) and its package for sensing...

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Raymond Foo joins IPC as new Southeast Asia

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Mario Orduz appointed Global Technical Manager, PWB by Enthone

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Rainbow Technology Systems continues international expansion

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Enthone appointed Chris Klok, European Market Manager, OEM and PCB Finishes

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IeMRC 7th Annual Conference, Loughborough, UK, 5 September 2012

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EIPC Summer Conference Day 2

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EIPC Summer ConferenceMilan, 13-14 September 2012

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Editorial

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DNA as a digital storage medium

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Spirit Circuits achieve certification for metal base PCBs

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IPC introduces new conference and exhibition for electronics industry...

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Global PCB industry grew 2.4 percent to more than $59 billion in 2011 – IPC...

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Polar Instruments, Inc. adds equipment sales and service to software sales...

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Atotech/Saarland University developed self-repairing process to stop wear on...

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Invotec Group: opens formal apprentice scheme skills, training and career...

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KIC introduces ProBot – the profiling robot that perfects your AOI and batch...

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SCHMID’s vertical processing line outperforms standard solutions for...

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Analysis of structure characteristics of a flying probe tester

AbstractPurpose– The purpose of this paper is to present a method for evaluating the structural dynamic characteristics of a flying probe tester. Design/methodology/approach– The dynamic...

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