Development of new laminates for high performance interconnection technology...
AbstractPurpose– The purpose of this paper is to detail various aspects of laminates and their current developments in order to enable the selection and development of appropriate laminate systems for...
View ArticleThe impact of carbon content and mesh on the characteristics of screen...
AbstractPurpose– The purpose of this paper is to carry out a comprehensive experimental investigation into the role of screen and conductive carbon material formulation on line conductivity and...
View ArticlePrinted circuit board technologies for thermal management
AbstractPurpose– The purpose of this paper is to a provide short introductory overview of metal in board (MiB) circuit technologies for use in thermal management applications....
View ArticleManufacture of an aluminum rigid-flex circuit assembly without the use of solder
AbstractPurpose– The purpose of this paper is to describe a novel method for the manufacture of aluminum rigid-flex circuit assemblies without the use of solder. Design/methodology/approach– The...
View ArticleA solution for micro drill condition monitoring with vibration signals for...
AbstractPurpose - The objective of this study is to develop an automated tool condition monitoring scheme for PCB drilling.Design/methodology/approach - Vibration signals are used to distinguish micro...
View ArticlePreparation and Performances of Coated and Aluminous Entry Boards with...
AbstractPurpose - The purpose of this paper is to provide a new entry board for drilling holes on the PCBs, superior in heat removal effect, lubricating effect and hole locating effect in forming...
View ArticleFailure Mechanism of Solder Bubbles in PCB Vias during High-temperature Assembly
AbstractPurpose - to analyze failure mechanism of solder bubbles in PCB viasDesign/methodology/approach - The mechanism of failure PCB vias with solder bubbles was investigated through cross sections...
View ArticlePCB Failure Analysis Related to the ENIG Black Pad Problem
AbstractPurpose - To verify the principal conclusions, done during the implementation of FP7 ASPIS project objectives in fundamental research of ENIG-related failures by investigating real problematic...
View ArticleCharacterization of PCB Routing Process and Optimization of Tool Design Based...
AbstractPurpose - The purpose of this paper is to provide the method and system to conduct on-line measurement and the characterization of temperature during PCB routing process as well as the...
View ArticleInvestigation of tool wear mechanism and tool geometry optimization in...
AbstractPurpose - The paper aims to investigate tool wear mechanism and tool geometry optimization of drilling PCB fixture hole.Design/methodology/approach - An experimental study were carried out to...
View ArticleThe application of mineral casting in high-precision printed circuit board...
AbstractPurpose - The purpose of this paper is to verify the feasibility and reliability of mineral casting applied in high-precision printed circuit board (PCB) drilling machine. The mechanical...
View ArticlePrinted silver circuits for FMCG packaging
AbstractPurpose - Printed flexible circuits which combined conventional silicon technology will enable the realisation of many value added products such as smart packaging for the FMCG industry (fast...
View ArticleMulti-shot printing of conductive tracks using a dry carbon nanotube ink
AbstractPurpose - Wearable electronics is an emerging technology predicted to become a 50B$ industry by 2018. Components and circuits will be highly integrated into clothing and other apparel. One...
View ArticleSelf-Aligned Flat Ultra-Thin Chip Package for Flexible Circuits
AbstractPurpose - Ultra-thin chip packaging (UTCP) is one of the flexible assembly technologies, by which thinned dies are encapsulated inside spin-coated dielectric films. For sake of higher density...
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